tggzzz wrote: ↑Thu Feb 12, 2026 1:03 pm
I have various Metcal tips, but not a knife.
I've never investigated knives, so I don't know their advantages. For desoldering, my presumption is that they won't be long enough to touch all the contacts on one side of an IC, and hence less than perfectly sufficient. For soldering, one-at-a-time or drag soldering seems sufficient.
For desoldering large components, especially through hole, I have mostly settled on hot air, or one-at-a-time with handheld solder pump (flexible silicone nozzle) and/or wick.
I suppose there are industrial desoldering stations which cost thousands and will painlessly desolder just about anything. Even then they may have problems with leads which are a tight fit and are bent over, on densely packed boards. There's ultra low melting point solder which might help but is expensive.
I've never found there's any one technique which is a winner every time. A lot depends on whether the component is expendable or the board is expendable. If you want both intact it becomes a lot harder.
I use
a cheap desoldering station, which sometimes works like a charm.
a soldering iron and solder sucker. Good if the iron can go one side of the board and the sucker on the other side.
braid.
heat spreaders made from thick copper wire.
a soldering iron and moving the component from side to side. Works best with components with two leads.
heating the board with a painter's hot air gun and hitting it on a brick.
two soldering irons for some SMD parts.
I suppose I should look into getting a proper hot air station.